? 1/6 EMIF06-VID01F2 6 lines low capacitance emi filter and esd protection rev. 1 february 2005 ipad? ? flip-chip (15 bumps) figure 1: pin configuration (ball side) i4 o4 i1 o1 i6 gnd gnd gnd o6 i3 o3 i5 o5 i2 o2 987 654 321 a b c tm: ipad is a trademark of stmicroelectronics. table 1: order code part number marking EMIF06-VID01F2 gr main application where emi filtering in esd sensitive equipment is required: lcd and camera for mobile phones computers and printers communication systems mcu board description the EMIF06-VID01F2 is a 6 lines highly integrated array designed to suppress emi / rfi noise in all systems subjected to electromagnetic interferenc- es. the EMIF06-VID01F2 flip-chip packaging means the package size is equal to the die size. additionally, this filter includes an esd protection circuitry which prevents the protected device from destruction when subjected to esd surges up to 15 kv. benefits high efficiency emi filtering (-40db @ 900mhz) low line capacitance suitable for high speed data bus low serial resistance for camera impedance adaptation lead free package optimized pcb space consuming: 2.92mm x 1.29mm very thin package: 0.65 mm high efficiency in esd suppression on inputs pins (iec61000-4-2 level 4) high reliability offered by monolithic integration high reducing of parasitic elements through integration & wafer level packaging complies with the following standards: iec61000-4-2 level 4 on input pins 15kv (air discharge) 8kv (contact discharge) mil std 883e - method 3015-6 class 3 figure 2: configuration r = 100 c = 16pf typ. @ 3v ? line input r output
EMIF06-VID01F2 2/6 table 2: absolute ratings (limiting values) table 3: electrical characteristics (t amb = 25c) symbol parameter and test conditions value unit t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage r series resistance between input & output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1ma 6810v i rm v rm = 3v per line 500 na r i = 10ma 80 100 120 ? c line v r = 3v dc 1mhz v osc = 30mv 16 19 pf i v v br v rm i rm i r i rm i r v rm v br
EMIF06-VID01F2 3/6 figure 3: s21 (db) attenuation measurement figure 4: analog crosstalk measurement figure 5: esd response to iec61000-4-2 (+15kv air discharge) on one input v(in) and on one output (vout) figure 6: esd response to iec61000-4-2 (-15kv air discharge) on one input v(in) and on one output (vout) figure 7: junction capacitance versus reverse voltage applied (typical values) 100k 1m 10m 100m 1g -60 -50 -40 -30 -20 -10 0 db f/hz 100k 1m 10m 100m 1g -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 db f/hz input 10v/d output 10v/d 200ns/d input 10v/d output 10v/d 200ns/d v (v) line c (pf) line 10 12 14 16 18 20 22 24 26 28 0.0 0.5 1.0 1.5 2.0 2.5 3.0 10 12 14 16 18 20 22 24 26 28 0.0 0.5 1.0 1.5 2.0 2.5 3.0
EMIF06-VID01F2 4/6 figure 8: ordering information scheme figure 9: flip-chip package mechanical data figure 10: foot print recommendations figure 11: marking emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f2 = leadfree flip-chip x = 1: 500m, bump = 315m = 2: leadfree pitch = 500m, bump = 315m 2.92mm 50m 1.29mm 50m 435m 50 315m 50 5 01m 50 500m 50 250m 50 650m 65 copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 300m copper pad diameter dot, st logo xx = marking yww = date code (y = year ww = week) z = packaging location 365 365 240 40 220 x y z w x w all dimensions in m e
EMIF06-VID01F2 5/6 figure 12: flip-chip tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.73 +/- 0.05 xxx yww st e xxx yww st e xxx yww st e table 4: ordering information note: more packing informations are available in the application note an1235: ?flip-chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? ordering code marking package weight base qty delivery mode EMIF06-VID01F2 gr flip-chip 5.4 mg 5000 tape & reel 7? table 5: revision history date revision description of changes 15-feb-2005 1 first issue.
EMIF06-VID01F2 6/6 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2005 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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